Electronic Modelling (continued as Engineering Simulation: An International Journal of Electrical, Electronic and other Physical Systems), 3, 99-101, 1992
An increasing scale of integration of microelectronic curcuits requires the development of more accurate mathematical models for their thermal management. Linear models are becoming increasing inadequate for this purpose. In this paper, a mathematical model is formulated for the analysis of thermal conditions of integrated microcircuits, accounting for the temperature dependency of coefficients based on experimental data. This leads to a nonlinear problem and an efficient numerical methodology for its solution is proposed and discussed on examples.